JEDEC STANDARDS PDF
JEDEC is the global leader in developing open standards for the microelectronics industry. With over 4,000 volunteers representing nearly 300 member companies. JEDEC brings manufacturers and suppliers together on 50 different committees, creating standards to meet the diverse technical and developmental needs of the industry. These collaborations ensure product interoperability, benefiting the industry and ultimately consumers by decreasing time-to-market and reducing product development costs.
JEDEC JESD22-B107D (R2018)
This test method provides two tests for determining the marking permanency of ink marked integrated ..
$27.00 $54.00
JEDEC JESD22-B108B
The purpose of this test is to measure the deviation of the terminals (leads or solder balls) from c..
$27.00 $53.00
JEDEC JESD22-B109A
The Flip Chip Tensile Pull Test Method is performed to determine the fracture mode and strength of t..
$28.00 $56.00
JEDEC JESD22-B109B
The Flip Chip Tensile Pull Test Method is performed to determine the fracture mode and strength of t..
$28.00 $56.00
JEDEC JESD22-B110B
Component and Subassembly Mechanical Shock Test Method is intended to evaluate components in the fre..
$27.00 $54.00
JEDEC JESD22-B110B.01
Device and Subassembly Mechanical Shock Test Method is intended to evaluate devices in the free stat..
$27.00 $54.00
JEDEC JESD22-B111
This Board Level Drop Test Method is intended to evaluate and compare drop performance of surface mo..
$31.00 $62.00
JEDEC JESD22-B111A
This Board Level Drop Test Method is intended to evaluate and compare drop performance of surface mo..
$34.00 $67.00
JEDEC JESD22-B112A
The purpose of this test method is to measure the deviation from uniform flatness of an integrated c..
$37.00 $74.00
JEDEC JESD22-B113
The Board Level Cyclic Bend Test Method is intended to evaluate and compare the performance of surfa..
$31.00 $62.00
JEDEC JESD22-B113B
The Board Level Cyclic Bend Test Method is intended to evaluate and compare the performance of surfa..
$34.00 $67.00
JEDEC JESD22-B114A
This standard describes a nondestructive test to assess solid state device mark legibility. The spec..
$28.00 $56.00
JEDEC JESD22-B115A
This document describes a test method only; acceptance criteria and qualification requirements are n..
$31.00 $62.00
JEDEC JESD22-B115A.01
This document describes a test method only; acceptance criteria and qualification requirements are n..
$34.00 $67.00
JEDEC JESD22-B116A
This test provides a means for determining the strength of a gold ball bond to a die bonding surface..
$31.00 $62.00
JEDEC JESD22-B116B
This test provides a means for determining the strength of a gold ball bond to a die bonding surface..
$37.00 $74.00