JEDEC STANDARDS PDF

JEDEC is the global leader in developing open standards for the microelectronics industry. With over 4,000 volunteers representing nearly 300 member companies. JEDEC brings manufacturers and suppliers together on 50 different committees, creating standards to meet the diverse technical and developmental needs of the industry. These collaborations ensure product interoperability, benefiting the industry and ultimately consumers by decreasing time-to-market and reducing product development costs.

JEDEC JESD50C

This standard applies to the identification and control of Maverick Product that can occur during fa..

$30.00 $60.00

JEDEC JESD51

This standard and its subsequent addendum's, provides a standard for thermal measurement that, if fo..

$26.00 $51.00

JEDEC JESD51-1

The purpose of this test method is to define a standard Electrical Test Method (ETM) that can be use..

$39.00 $78.00

JEDEC JESD51-10

This standard covers the design of printed circuit boards (PCBs) used in the thermal characterizatio..

$28.00 $56.00

JEDEC JESD51-11

This standard covers the design of printed circuit boards (PCBs) used in the thermal characterizatio..

$30.00 $59.00

JEDEC JESD51-12

This document provides guidelines for both reporting and using electronic package thermal informatio..

$31.00 $62.00

JEDEC JESD51-12.01

This document provides guidelines for both reporting and using electronic package thermal informatio..

$36.00 $72.00

JEDEC JESD51-13

This document provides a unified collection of the commonly used terms and definitions in the area o..

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JEDEC JESD51-14

This document specifies a test method (referred to herein as "Transient Dual Interface Measurement")..

$40.00 $80.00

JEDEC JESD51-2A

This document outlines the environmental conditions necessary to ensure accuracy and repeatability f..

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JEDEC JESD51-3

This standard describes design requirements for a single layer, leaded surface mount integrated circ..

$27.00 $53.00

JEDEC JESD51-31

This document specifies the appropriate modifications needed for Multi-Chip Packages to the thermal ..

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JEDEC JESD51-32

This document addresses the need for extending the existing thermal test board standards to accommod..

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JEDEC JESD51-4

This guideline describes design requirements for wire bond type semiconductor chips to be used for t..

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JEDEC JESD51-4A

The purpose of this document is to provide a design guideline for thermal test chips used for integr..

$34.00 $67.00

JEDEC JESD51-5

This extension of the thermal standards provides a standard fixture for direct attach type packages ..

$24.00 $48.00

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