• ASTM F3192-16

ASTM F3192-16

  • Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization
  • standard by ASTM International, 09/01/2016
  • Category: ASTM

$48.00 $24.00

1.1 This specification details the generic criteria requirements of high pure copper sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advanced packaging.

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