ASTM F3192-16
- Standard Specification for High-Purity Copper Sputtering Target Used for Through-Silicon Vias (TSV) Mettalization
- standard by ASTM International, 09/01/2016
- Category: ASTM
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$24.00
1.1 This specification details the generic criteria requirements of high pure copper sputtering targets used as thin film material for through-silicon vias (TSV) metallization in advanced packaging.
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