• JEDEC JEP140 (R2006)

JEDEC JEP140 (R2006)

  • BEADED THERMOCOUPLE TEMPERATURE MEASUREMENT OF SEMICONDUCTOR PACKAGES
  • standard by JEDEC Solid State Technology Association, 06/01/2002
  • Category: JEDEC

$54.00 $27.00

The beaded thermocouple temperature measurement guideline provides a procedure to accurately and consistently measure the temperature of semiconductor packages during exposure to thermal excursions. The guideline applications can include, but not limited to, temperature profile measurement in reliability test chambers and solder reflow operations that are associated with component assembly to printed wiring boards.
PDF

All of our standards document are available in PDF (Portable Document Format), an electronic, downloadable format.You will be able to download the file in your account downloads.

Multi-User Access

After purchasing, you have the ability to assign each license to a specific user.

Printable

At any time, you are permitted to make printed copies for your and your members' reference use.

JEDEC JESD8C.01

JEDEC JESD8C.01

INTERFACE STANDARD FOR NOMINAL 3.0 V/3.3 V SUPPLY DIGITAL INTEGRATED CIRCUITS..

$28.00 $56.00

JEDEC JESD 8-11A.01

JEDEC JESD 8-11A.01

ADDENDUM No. 11A.01 to JESD8 - 1.5 V +/- 0.1 V (NORMAL RANGE) AND 0.9 - 1.6 V (WIDE RANGE) POWER SUP..

$27.00 $53.00

JEDEC JESD22-B102E

JEDEC JESD22-B102E

SOLDERABILITY..

$34.00 $67.00

JEDEC JESD89-1A

JEDEC JESD89-1A

TEST METHOD FOR REAL-TIME SOFT ERROR RATE..

$28.00 $56.00