• JEDEC JEP170

JEDEC JEP170

  • Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA)
  • standard by JEDEC Solid State Technology Association, 01/01/2013
  • Category: JEDEC

$59.00 $30.00

This publication provides description of defects observed in FCxGA components that can adversely impact end-user products and/or applications. It will also provide illustration on other defects that may be considered visual nonconformities since they should be less disruptive of quality or reliability to customer products. Finally, it will depict a method for visual inspection that can be utilized to identify these defects or visual nonconformities and guidance for disposition. Official criteria for product acceptance should be in actual product drawings and specifications.
PDF

All of our standards document are available in PDF (Portable Document Format), an electronic, downloadable format.You will be able to download the file in your account downloads.

Multi-User Access

After purchasing, you have the ability to assign each license to a specific user.

Printable

At any time, you are permitted to make printed copies for your and your members' reference use.

JEDEC JESD22-B102E

JEDEC JESD22-B102E

SOLDERABILITY..

$34.00 $67.00

JEDEC JESD89-1A

JEDEC JESD89-1A

TEST METHOD FOR REAL-TIME SOFT ERROR RATE..

$28.00 $56.00

JEDEC JESD89-2A

JEDEC JESD89-2A

TEST METHOD FOR ALPHA SOURCE ACCELERATED SOFT ERROR RATE..

$30.00 $60.00

JEDEC JESD61A.01

JEDEC JESD61A.01

ISOTHERMAL ELECTROMIGRATION TEST PROCEDURE..

$44.00 $87.00