• JEDEC JESD214.01

JEDEC JESD214.01

  • CONSTANT-TEMPERATURE AGING METHOD TO CHARACTERIZE COPPER INTERCONNECT METALLIZATIONS FOR STRESS-INDUCED VOIDING
  • standard by JEDEC Solid State Technology Association, 08/01/2017
  • Category: JEDEC

$72.00 $36.00

This document describes a constant temperature (isothermal) aging method for testing copper (Cu) metallization test structures on microelectronics wafers for susceptibility to stress-induced voiding (SIV). This method is to be conducted primarily at the wafer level of production during technology development, and the results are to be used for lifetime prediction and failure analysis. Under some conditions, the method may be applied to package-level testing. This method is not intended to check production lots for shipment, because of the long test time.
PDF

All of our standards document are available in PDF (Portable Document Format), an electronic, downloadable format.You will be able to download the file in your account downloads.

Multi-User Access

After purchasing, you have the ability to assign each license to a specific user.

Printable

At any time, you are permitted to make printed copies for your and your members' reference use.

JEDEC JESD51-4

JEDEC JESD51-4

THERMAL TEST CHIP GUIDELINE (WIRE BOND TYPE CHIP)..

$28.00 $56.00

JEDEC EIA 670

JEDEC EIA 670

QUALITY SYSTEM ASSESSMENT (SUPERSEDES JESD39-A)..

$40.00 $80.00

JEDEC JESD59

JEDEC JESD59

BOND WIRE MODELING STANDARD..

$28.00 $56.00

JEDEC JESD63

JEDEC JESD63

STANDARD METHOD FOR CALCULATING THE ELECTROMIGRATION MODEL PARAMETERS FOR CURRENT DENSITY AND TEMPER..

$39.00 $78.00