• JEDEC JESD22-A106B

JEDEC JESD22-A106B

  • THERMAL SHOCK
  • standard by JEDEC Solid State Technology Association, 06/01/2004
  • Category: JEDEC

$51.00 $26.00

This test is conducted to determine the resistance of a part to sudden exposure to extreme changes in temperature and to the effect of alternate exposures to these extremes.
PDF

All of our standards document are available in PDF (Portable Document Format), an electronic, downloadable format.You will be able to download the file in your account downloads.

Multi-User Access

After purchasing, you have the ability to assign each license to a specific user.

Printable

At any time, you are permitted to make printed copies for your and your members' reference use.

JEDEC JESD51-3

JEDEC JESD51-3

LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD FOR LEADED SURFACE MOUNT PACKAGES..

$27.00 $53.00

JEDEC JEP128

JEDEC JEP128

GUIDE FOR STANDARD PROBE PAD SIZES AND LAYOUTS FOR WAFER LEVEL ELECTRICAL TESTING..

$26.00 $51.00

JEDEC JESD57

JEDEC JESD57

TEST PROCEDURE FOR THE MANAGEMENT OF SINGLE-EVENT EFFECTS IN SEMICONDUCTOR DEVICES FROM HEAVY ION IR..

$44.00 $87.00

JEDEC JESD51-4

JEDEC JESD51-4

THERMAL TEST CHIP GUIDELINE (WIRE BOND TYPE CHIP)..

$28.00 $56.00