• JEDEC JESD22-B106D

JEDEC JESD22-B106D

  • RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES
  • standard by JEDEC Solid State Technology Association, 04/01/2008
  • Category: JEDEC

$53.00 $27.00

This method established a standard procedure for determining whether through-hole solid state devices can withstand the effects of the temperature to which they will be subject during soldering of their leads. This revision updates the references to currently military standards.
PDF

All of our standards document are available in PDF (Portable Document Format), an electronic, downloadable format.You will be able to download the file in your account downloads.

Multi-User Access

After purchasing, you have the ability to assign each license to a specific user.

Printable

At any time, you are permitted to make printed copies for your and your members' reference use.

JEDEC JEP119A

JEDEC JEP119A

A PROCEDURE FOR EXECUTING SWEAT..

$37.00 $74.00

JEDEC JESD92

JEDEC JESD92

PROCEDURE FOR CHARACTERIZING TIME-DEPENDENT DIELECTRIC BREAKDOWN OF ULTRA-THIN GATE DIELECTRICS..

$37.00 $74.00

JEDEC JESD8-15A

JEDEC JESD8-15A

STUB SERIES TERMINATED LOGIC FOR 1.8 V (SSTL_18)..

$31.00 $62.00

JEDEC JESD68.01

JEDEC JESD68.01

COMMON FLASH INTERFACE (CFI)..

$30.00 $60.00