• JEDEC JESD22-B115A.01

JEDEC JESD22-B115A.01

  • SOLDER BALL PULL
  • standard by JEDEC Solid State Technology Association, 07/01/2016
  • Category: JEDEC

$67.00 $34.00

This document describes a test method only; acceptance criteria and qualification requirements are not defined. This test method applies to solder ball pull force/energy testing prior to end-use attachment. Solder balls are pulled individually using mechanical jaws; force, fracture energy and failure mode data are collected and analyzed. Other specialized solder ball pull methods using a heated thermode, gang pulling of multiple solder joints, etc., are outside the scope of this document. Both low and high speed testing are covered by this document. This is a minor editorial revision to JESD22-A115A.
PDF

All of our standards document are available in PDF (Portable Document Format), an electronic, downloadable format.You will be able to download the file in your account downloads.

Multi-User Access

After purchasing, you have the ability to assign each license to a specific user.

Printable

At any time, you are permitted to make printed copies for your and your members' reference use.

JEDEC JESD99C

JEDEC JESD99C

Terms, Definitions, and Letter Symbols for Microelectronic Devices..

$82.00 $163.00

JEDEC JEP170

JEDEC JEP170

Guidelines for Visual Inspection and Control of Flip Chip Type Components (FCxGA)..

$30.00 $59.00

JEDEC JEP162

JEDEC JEP162

System Level ESD: Part II: Implementation of Effective ESD Robust Designs..

$96.00 $191.00

JEDEC JESD79-3-1A

JEDEC JESD79-3-1A

Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, and DDR3L-1600..

$34.00 $67.00