• JEDEC JESD22-B116B

JEDEC JESD22-B116B

  • WIRE BOND SHEAR TEST
  • standard by JEDEC Solid State Technology Association, 04/01/2017
  • Category: JEDEC

$74.00 $37.00

This test provides a means for determining the strength of a gold ball bond to a die bonding surface or an aluminum wedge or stitch bond to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. The wire bond shear test is destructive. It is appropriate for use in process development, process control and/or quality assurance.
PDF

All of our standards document are available in PDF (Portable Document Format), an electronic, downloadable format.You will be able to download the file in your account downloads.

Multi-User Access

After purchasing, you have the ability to assign each license to a specific user.

Printable

At any time, you are permitted to make printed copies for your and your members' reference use.

JEDEC JEP159

JEDEC JEP159

PROCEDURE FOR THE EVQLUQTION OF LOW-k/METAL INTER/INTRA-LEVEL DIELECTRIC INTEGRITY..

$31.00 $62.00

JEDEC JESD22-B115A

JEDEC JESD22-B115A

SOLDER BALL PULL..

$31.00 $62.00

JEDEC JESD 78C

JEDEC JESD 78C

IC LATCH-UP TEST..

$36.00 $72.00

JEDEC JESD22-B108B

JEDEC JESD22-B108B

COPLANARITY TEST FOR SURFACE-MOUNT SEMICONDUCTOR DEVICES..

$27.00 $53.00