• JEDEC JESD22-B117A

JEDEC JESD22-B117A

  • SOLDER BALL SHEAR
  • standard by JEDEC Solid State Technology Association, 10/01/2006
  • Category: JEDEC

$56.00 $28.00

The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. Solder ball shear is a destructive test.
PDF

All of our standards document are available in PDF (Portable Document Format), an electronic, downloadable format.You will be able to download the file in your account downloads.

Multi-User Access

After purchasing, you have the ability to assign each license to a specific user.

Printable

At any time, you are permitted to make printed copies for your and your members' reference use.

JEDEC JESD217.01

JEDEC JESD217.01

TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES..

$44.00 $87.00

JEDEC JESD31E

JEDEC JESD31E

GENERAL REQUIREMENTS FOR DISTRIBUTORS OF COMMERCIAL AND MILITARY SEMICONDUCTOR DEVICES..

$37.00 $74.00

JEDEC JEP130B

JEDEC JEP130B

GUIDELINES FOR PACKING AND LABELING OF INTEGRATED CIRCUITS IN UNIT CONTAINER PACKING (TUBES, TRAYS, ..

$27.00 $54.00

JEDEC JESD22-B111A

JEDEC JESD22-B111A

BOARD LEVEL DROP TEST METHOD OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS..

$34.00 $67.00