• JEDEC JESD22-B118

JEDEC JESD22-B118

  • SEMICONDUCTOR WAFER AND DIE BACKSIDE EXTERNAL VISUAL INSPECTION
  • standard by JEDEC Solid State Technology Association, 03/01/2011
  • Category: JEDEC

$59.00 $30.00

This inspection method is for product semiconductor wafers and dice prior to assembly. This test method defines the requirements to execute a standardized external visual inspection and is a non-invasive and nondestructive examination that can be used for qualification, quality monitoring, and lot acceptance.
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