• JEDEC JESD51-12

JEDEC JESD51-12

  • GUIDELINES FOR REPORTING AND USING ELECTRONIC PACKAGE THERMAL INFORMATION
  • standard by JEDEC Solid State Technology Association, 05/01/2005
  • Category: JEDEC

$62.00 $31.00

This document provides guidelines for both reporting and using electronic package thermal information generated using JEDEC JESD51 standards. By addressing these two areas, this document can be used as the common basis for discussion between electronic package thermal information suppliers and users.
PDF

All of our standards document are available in PDF (Portable Document Format), an electronic, downloadable format.You will be able to download the file in your account downloads.

Multi-User Access

After purchasing, you have the ability to assign each license to a specific user.

Printable

At any time, you are permitted to make printed copies for your and your members' reference use.

JEDEC JESD22-A117D

JEDEC JESD22-A117D

ELECTRICALLY ERASABLE PROGRAMMABLE ROM (EEPROM) PROGRAM/ERASE ENDURANCE AND DATA RETENTION TEST..

$34.00 $67.00

JEDEC JESD251

JEDEC JESD251

EXPANDED SERIAL PERIPHERAL INTERFACE (xSPI) FOR NON VOLATILE MEMORY DEVICES, VERSION 1.0..

$58.00 $116.00

JEDEC JEP132A

JEDEC JEP132A

PROCESS CHARACTERIZATION GUIDELINE..

$39.00 $78.00

JEDEC JEP001-2A

JEDEC JEP001-2A

FOUNDRY PROCESS QUALIFICATION GUIDELINES - FRONT END TRANSISTOR LEVEL (Wafer Fabrication Manufacturi..

$39.00 $78.00