JEDEC JESD51-31
- THERMAL TEST ENVIRONMENT MODIFICATIONS FOR MULTICHIP PACKAGES
- standard by JEDEC Solid State Technology Association, 07/01/2008
- Category: JEDEC
$59.00
$30.00
This document specifies the appropriate modifications needed for Multi-Chip Packages to the thermal test environmental conditions specified in the JESD51 series of specifications. The data obtained from methods of this document are the raw data used to document the thermal performance of the package. The use of this data will be documented in JESD51-XX, Guideline to Support Effective Use of MCP Thermal Measurements which is being prepared.
PDF
All of our standards document are available in PDF (Portable Document Format), an electronic, downloadable format.You will be able to download the file in your account downloads.
Multi-User Access
After purchasing, you have the ability to assign each license to a specific user.
Printable
At any time, you are permitted to make printed copies for your and your members' reference use.