• JEDEC JESD59

JEDEC JESD59

  • BOND WIRE MODELING STANDARD
  • standard by JEDEC Solid State Technology Association, 06/01/1997
  • Category: JEDEC

$56.00 $28.00

This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a ball or wedge type wire bond configuration.
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